JPH0559583B2 - - Google Patents
Info
- Publication number
- JPH0559583B2 JPH0559583B2 JP1736083A JP1736083A JPH0559583B2 JP H0559583 B2 JPH0559583 B2 JP H0559583B2 JP 1736083 A JP1736083 A JP 1736083A JP 1736083 A JP1736083 A JP 1736083A JP H0559583 B2 JPH0559583 B2 JP H0559583B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package body
- logic
- semiconductor
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1736083A JPS59144161A (ja) | 1983-02-07 | 1983-02-07 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1736083A JPS59144161A (ja) | 1983-02-07 | 1983-02-07 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59144161A JPS59144161A (ja) | 1984-08-18 |
JPH0559583B2 true JPH0559583B2 (en]) | 1993-08-31 |
Family
ID=11941871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1736083A Granted JPS59144161A (ja) | 1983-02-07 | 1983-02-07 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59144161A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5539156B2 (ja) * | 2010-10-29 | 2014-07-02 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
JP2014179484A (ja) * | 2013-03-15 | 2014-09-25 | Toshiba Corp | 半導体記憶装置 |
-
1983
- 1983-02-07 JP JP1736083A patent/JPS59144161A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59144161A (ja) | 1984-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6836007B2 (en) | Semiconductor package including stacked semiconductor chips | |
KR100753415B1 (ko) | 스택 패키지 | |
US6365966B1 (en) | Stacked chip scale package | |
US6452279B2 (en) | Semiconductor device | |
US5166866A (en) | Semiconductor package | |
JP4377269B2 (ja) | 半導体装置 | |
US5331200A (en) | Lead-on-chip inner lead bonding lead frame method and apparatus | |
JPH0559583B2 (en]) | ||
US7375422B2 (en) | Stacked-type semiconductor package | |
JP3124381B2 (ja) | 半導体装置及び実装構造体 | |
JPH05243482A (ja) | 半導体集積回路 | |
US20030094628A1 (en) | Memory module structure | |
US20100148338A1 (en) | Three Dimensional Semiconductor Device | |
JPS6129140A (ja) | 半導体装置 | |
JPH01137660A (ja) | 半導体装置 | |
JP3016049B2 (ja) | 半導体装置 | |
KR940005713B1 (ko) | 반도체 패키지 | |
KR20010058586A (ko) | 반도체패키지 및 이를 이용한 실장방법 | |
JPS63164261A (ja) | 半導体装置 | |
KR100368968B1 (ko) | 스택형 패키지 | |
JPS6016453A (ja) | 集積回路装置用パツケ−ジ | |
JP2004228259A (ja) | 半導体装置及びそれを用いた電子装置 | |
JPS62210661A (ja) | 半導体装置 | |
JPH02310957A (ja) | 半導体装置 | |
JPH0510367Y2 (en]) |